The BM 860 is an advancement of the BM 850 for processing larger multi c-Si formats and mono c-Si bricks. It is able to square the present G5 format (840 x 840mm), the new G6 format (1000 x 1000 mm) as well as 6 or 8 mono c-Si. The maximum work piece height has been increased up to 550 mm. Both versions of the BrickMaster have especially been developed for applying Diamond Wire.
As consequence of the high feed rate, the output is 100 percent higher compared to slurry based systems. Furthermore, the G6 format increases the output by additional 40 percent up to 240 MW (multi c-Si). In processing mono c-Si there is a capacity of 200 MW. Compared to slurry based systems the total cost of ownership of the BM 860 can be reduced by up to 25 percent.
The BM 860 is based on a new machine concept. The cutting room is freely accessible at 300° and enables easy loading by fork lift or elevating platform truck. The foot print was optimized through compact arrangement of the different components. At same production volume the BM 860 needs 60 percent less space than competitors.The number of pulleys is minimized which significantly reduces the costs for wear parts.
The proven concept of the extractable cutting unit was maintained and even optimized with a quick release system for a fast changeover of complete shafts. Thus, downtimes are 50 percent lower compared to current slicing systems. The BM 860 is based on the market proven Meyer Burger wire saw technology being equipped with diamond wire technology (DW) by Diamond Materials Tech Inc., USA, a member of Meyer Burger Technology Group.
